Intel
US, Oregon, Hillsboro
+ 1 other location
Intel Technology Research is advancing the future of AI and high-performance computing through innovative advanced packaging technologies and 3D heterogeneous integration. Enabling novel system architecture, developing innovating process integration and establishing predictive physics-based simulation capabilities are critical for enabling complex large form factor packages with high-bandwidth interconnect. As an Advanced Packaging Integration and Simulation Intern, you will collaborate with leading researchers, process engineers, and modeling experts to develop and assess next-generation package architectures. In this role, you will contribute to advanced Research and Dev across package integration, process flow definition and development, package modeling, yield and reliability assessment, and data analytics.
Key Responsibilities
Support advanced packaging integration activities across wafer-level and package-level process flows, including wafer level process, 2.5D/3D integration, chiplet integration, and hybrid bonding-related modules.
Develop and execute Design of Experiments (DOE) to understand relationships among package architecture, process conditions, material behavior, and electrical/mechanical performance.
Build, calibrate, and apply simulation models to understand mechanical characteristics of packages, interconnect quality, thermal performance, etc.
Conduct thermo-mechanical simulations to evaluate material responses to temperature, stress, and package-level loading conditions.
Analyze inspection, process, and simulation data to identify root causes of integration challenges and recommend improvement paths.
Collaborate with cross-functional teams to optimize process flows for yield, reliability, manufacturability, and package performance.
Present findings through technical presentations and potential publications.
What You Will Gain
:
Minimum Qualifications
Candidate must be pursuing a
PhD degree
in Mechanical Engineering, Materials Science and Engineering, Electrical Engineering, Physics, Manufacturing Engineering, or a closely related STEM discipline
Must be available to work full-time for the duration of a 3-month internship.
3+ months of academic or professional experience in one or more of the following areas:
6+ months of academic or professional experience in one or more of the following areas:
Join us at Intel to contribute to technological advancements while building a rewarding and impactful career. Apply now to be a part of our extraordinary journey.
Student / Intern
Shift 1 (United States of America)
US, Arizona, Phoenix
US, Oregon, Hillsboro
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
N/A
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.